XIAMEN INNOVACERA ADVANCED MATERIALS CO., LTD
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Price: | 1.0 USD |
Payment Terms: | T/T |
Place of Origin: | Fujian, China (Mainland) |
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Resistant High Temperature HPBN Ceramic BN Cone Crucible For Pharmaceutical Industries/Innovacera
Keywords: BN Crucible, BN Cylinder Crucible, BN Conical Crucible, BN Taper Crucible, BN conicity crucible, BN cylinderal crucible, BN round Crucible.
Product Description
Using the BN crucible, can use in temperature 1800 degrees C in vacuum condition, not bonded with the metal liquid, non-reactive, thermal shock resistance, resistance to corrosion, coating evenly. Thermal shock cracking, adhesive products, do not contaminate the product.
Hot pressed BN is compacted at temperatures up to 2000°C and pressures up to 2000 psi to form a dense, strong engineering material that is easily machined. It is available in standard and custom hot pressed shapes and has several unique characteristics and physical properties which make it valuable for solving tough problems in a wide range of industrial applications.
The HPBN Crucible is widely used For Semiconductor, Electronics, Metallurgical, Thin Film, and Pharmaceutical Industries.
Hot pressed boron nitride shapes are used as critical components in applications where excellent thermal shock resistance, high electrical resistivity and chemical and corrosion resistance is required.
High Temperature Insulators
Molten Metal crucibles and nozzles
High temperature furnace components
Rollers and formers for the glass industry
Thermocouple Tubes
Properties | Units | Boron Nitride (BN) | ||
HPBN | PBN | |||
Mechanical | Density | g/cm3 | 2.2~2.3 | 2.1-2.19 |
Color | _ | white | white | |
Water Absorption | % | 0 | 0 | |
Vickers Hardness | Gpa | (Moh's=2) | (Knoop=691) | |
Flexural Strength (20°C) | Mpa | 100 | 243.63 | |
Compressive Strength (20°C) | Mpa | 287 | _ | |
Thermal | Thermal Conductivity (20°C) | W/m.K | 35 | 43-60 |
Thermal Shock Resistance (20°C) | Δ T(C) | _ | _ | |
Maximum Use Temperature | °C | 2400 | 2200 | |
Electrical | Volume Resistivity (25°C) | Ω.cm | 10 ^ 8~10 ^ 13 | 3.11x10 ^ 11 |
Boron Nitride
Technical Boron Nitride Features:
1.High thermal conductivity
2.Low thermal expansion
3.Good thermal shock resistance
4.High electrical resistance
5.Low dielectric constant and loss tangent
6.Microwave transparency
7.Non toxic
8.Easily machined - non abrasive and lubricious
9.Chemically inert
10.Not wet by most molten metals
H/PBN Application
Technical Boron Nitride Application:
1.Electronic Parts - heat sinks, substrates, coil forms, prototypes
2.Boron doping wafers in silicon semiconductor processing
3.Vacuum melting crucibles
4.CVD crucibles
5.Microcircuit packaging
6.Sputtering targets
7.High precision sealing, brazing, and metallizing fixtures
8.Microwave tubes
9.Horizonatal caster break rings
10.Low friction seals
11.Plasma arc insulators
12.High temperature furnace fixtures and supports
Certifications